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EZI PC100 - Plasma cleaning tool

The PC100 plasma cleaning tool is a batch cleaning tool with downstream plasma (wafers are placed vertically inside the chamber). The downstream plasma will not attack any in-organic materials including metals on the wafer surface. The tool can be equipped with 3 nm filters to ensure super low particle contamination on the wafers after cleaning.
 
Features of the EZI PC100
  • Chamber size 13 inch diameter x 10.5 inch depth
  • Chamber capacity up to 1 cassette 8 inch wafers (minimum gap between wafers should be 5 mm)
  • Throughput ~30 min/cleaning cycle (for regular cleaning)
  • Plasma mode downstream plasma
  • Automatic process control
  • Operating pressure 50 mTorr to 1 Torr
  • Operating power 35 W to 75 W
  • Compatible gases air, argon, oxygen, nitrogen, and hydrogen
  • Power requirement 110-230 VAC, 50/60Hz input
  • Vacuum pump requirement oil free dry pump, larger than 3.2 CFM
   
 
 
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