NIL Technology offers two Sub-micro standard stamps that are optimal for testing and process
development within thermal and UV nanoimprint lithography and hot embossing.

The SMLA V1 stamp contains a 50 mm x 50 mm uniform array whereas the SMSS V1 stamp contains 3 different patterns (line grating, pillar array and hole array) at 3 different lateral dimensions, 500 nm, 1 µm and 2 µm. All patterns are half-pitch patterns.

The sub-micro standard stamps can be delivered with or without anti-sticking coating

Specifications for Sub-Micro standard stamps

Stamp size150 mm diameter
Stamp materialSilicon
Stamp thickness1 mm
Structure size500 nm
Etch depth1 µm
Pattern field size50 mm x 50 mm
Pattern1 µm pitch lines and spaces or triangular arranged holes or pillars
Stamp size20 mm x 20 mm
Stamp materialSilicon or Fused Silica
Stamp thickness1 mm
Structure size500 nm – 2 µm
Etch depth1 µm or 2 µm in Silicon. 500 nm in Fused Silica
Pattern field size5 mm x 5 mm x 9

Examples - Sub-Micro Standard Stamps