Sub-Micro

NIL Technology offers two Sub-micro standard stamps that are optimal for testing and process
development within thermal and UV nanoimprint lithography and hot embossing.

The SMLA V1 stamp contains a 50 mm x 50 mm uniform array whereas the SMSS V1 stamp contains 3 different patterns (line grating, pillar array and hole array) at 3 different lateral dimensions, 500 nm, 1 µm and 2 µm. All patterns are half-pitch patterns.

The sub-micro standard stamps can be delivered with or without anti-sticking coating

Specifications for Sub-Micro standard stamps

Stamp ID
SMLA_V1
SMSS_SIQZ_V1
Stamp size
150 mm diameter
20 mm x 20 mm
Stamp material
Silicon
Silicon or Fused Silica
Stamp thickness
1 mm
1 mm
Structure size
5oo nm
500 nm – 2 µm
Etch depth
1 µm
1 µm or 2 µm in Silicon. 500 nm in Fused Silica
Pattern field size
50 mm x 50 mm
5 mm x 5 mm x 9
Pattern
1 µm pitch lines and spaces or triangular arranged holes or pillars

Examples - Sub-Micro Standard Stamps