PDMS stamps are the first industrially used working stamps. They are soft and porous, so they can easily adsorb small air inclusions or gasses from degassing polymers during heating.
The main problem with PDMS has been lack of resolution and the material being too soft, so the structures would collapse and stick to each other. The traditional Sylgaard 184 PDMS solution can achieve a minimum structure size of 3-400 nm. Different PDMS formulations, such as h-PDMS and x-PDMS, can achieve structures in the sub-100 nm range.
PDMS stamps and how we can help
In NIL Technology we work mostly with a UV-curable PDMS that achieves structures in the 200 nm range down towards 100 nm. We also work with h-PDMS and x-PDMS.
PDMS stamps are fabricated with any design specified by customers. We can also offer to make PDMS stamps from customers’ existing silicon or fused silica stamps. When we make PDMS stamps, the pattern is defined by electron beam lithography, nanoimprint lithography (NIL) or UV lithography.
The PDMS stamps are typically delivered in round wafers shapes.
Specifications for our PDMS stamps:
|Stamp sizes (wafer)||Up to 6 inch round|
|Stamp thickness||1 mm (other upon request)|
|Minimum lateral dimension||100 nm|
|Aspect ratio||Up to 1:3 (pattern dependent)|
|Design file format||gds, dxf, tdb|
|Delivery time||Typically 4 weeks|
Advanced working stamps
Advanced working stamps have a thin layer of substance on a polymer or glass backbone. An example could be Ormostamp on a glass backbone. We work with many different variants of this type of advanced working stamps. With this type of PDMS stamp, you can tune the overall stiffness of your working stamp. Some formulations require anti-sticking coating before use. Others do not.
With advanced working stamps you can achieve successful replications of sub-100 nm structures in high volume manufacturing.