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Sub-Micro

The Sub-micro standard stamps are optimal for testing and process development within thermal and UV nanoimprint lithography and hot embossing. The SMLA stamps contain a 50 mm x 50 mm uniform array whereas the SMSS stamps contains 3 different patterns (line gratings, pillar arrays and hole arrays) at 3 different dimensions (500 nm, 1 µm and 2 µm). All patterns are half-pitch patterns.
 
Specification
 
Stamp ID SMLA_V1
Stamp size 150 mm diameter
Stamp material Silicon
Stamp thickness 1 mm
Structure size 500 nm
Etch depth 1 µm
Pattern field size 50 mm x 50 mm
Pattern 1 µm pitch lines and spaces or triangular arranged holes or pillars
Delivery time 3-4 weeks
 
Stamp ID SMSS_SIQZ_V1
Stamp size 20 mm x 20 mm
Stamp material Silicon or Fused Silica
Stamp thickness 1 mm
Structure size 500 nm - 2 µm
Etch depth 1 µm or 2 µm in Silicon. 500 nm in Fused Silica
Pattern field size 5 mm x 5 mm x 9
Delivery time 3-4 weeks
 
Anti-sticking layer (ASL) and dicing are optional

 
Examples
Sub-Micro Standard Stamps

Examples of patterns and features
Related information


 
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