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Electron Beam Lithography

NILT offers electron beam lithography services based on a Jeol JBX 9500 FSZ system (backup system: Jeol JBX 9300 FS).
The minimum achieved linewidth is 10 nm on this system. The JBX 9500 FSZ is a 100 kV system with a writing field of 1,000 µm x 1,000 µm. The system can expose 50 mm, 100 mm, 150 mm and 200 mm wafers as well as 6025 and 65 mm x 65 mm mask blanks.
NILT also offers a wide variety of pre- and post-processing of wafers if required.
Jeol JBX 9500 FSZ Specifications
Acceleration voltage 100kV
Writing field
1000 µm x 1000 µm
Max stiching error between fields 9 nm
Spot size 4 nm +/-1 nm
Resolution 10 nm
Registration accuracy Better than 11 nm across 6 inch x 6 inch area
Substrate sizes 2 inch wafer
4 inch wafer
6 inch wafer
8 inch wafer
65 mm x 65 mm fused silica plates
6025 mask blanks
Resist ZEP520A
Customer specified resists can be used HSQ (negative tone)
upon request SAL (negative tone)
EBL Service
Various patterns and features

Design file requirements
In order to allow easy handling of design files in GDSII, DXF, TDB or CIF format, the design file must fulfill the following:
  • The design file must contain all objects in the design in the correct dimensions, layout and polarity.
  • All objects in the design file must be polygons — no circular objects or line objects are allowed.
All design files handed over to NILT are kept strictly confidential and all design file data is deleted upon customer request.
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