NILT offers DUV stepper lithography services based on a Canon FPA-3000 EX4 248 nm stepper. The guaranteed minimum line width is 250 nm but 180 nm line width has been demonstrated on this system. For smaller line width, please refer to our EBL service.
The Canon FPA-3000 EX4 uses a 5X projection system resulting in a maximum field size on the substrate of 22 mm x 22 mm. The system can expose 100 mm, 150 mm and 200 mm wafers and NILT also offers a wide variety of pre- and post-processing of wafers if required.
All resists are used with a bottom anti-reflection coating (BARC, DUV42P) to prevent standing waves in the resist and to promote adhesion between resist and wafer.
Design file requirements
In order to allow easy handling of design files in GDSII, DXF, TDB or CIF format, the design file must fulfill the following:
All design files handed over to NILT are kept strictly confidential and all design file data is deleted upon customer request.