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This stamp is well suited for process testing within the fields of nanoimprint lithography and hot embossing. The stamp features arrays of square pillars/holes having a size of 3, 5, 10 and 20 µm. These arrays have varying protrusion coverage (11, 25 and 44%). The structure size allows for easy characterization by e.g. optical microscopy and stylus profilometry.
Specifications
| Stamp size |
100 mm diameter with a flat (SEMI standard wafer) |
| Stamp material |
Silicon |
| Stamp thickness |
525 µm |
| Structure size |
3, 5, 10, 20 µm |
| Structure shape |
Square pillars or holes |
| Structure height/depth |
300 nm |
| Delivery time |
2-3 weeks |
Anti-sticking layer and dicing are optional. Furthermore, the stamp can be made in thin polymer films upon customer request.
Examples
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Micro Test Standard Stamp
Design specifications
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Related information
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