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The Sub-micro standard stamp is optimal for testing and process development within thermal and UV nanoimprint lithography and hot embossing. The stamp contains 3 different patterns (line gratings, pillar arrays and hole arrays) at 3 different dimensions (500 nm, 1 µm and 2 µm). All patterns are half-pitch patterns. The stamp is offered in Silicon and Fused Silica and the size of the stamp is 20 mm x 20 mm.
Specifications
| Stamp size |
20 mm x 20 mm |
| Stamp material |
Silicon or Fused Silica |
| Stamp thickness |
1 mm |
| Structure size |
500 nm - 2 µm |
| Etch depth |
1 µm or 2 µm in Silicon. 500 nm in Fused Silica |
| Pattern field size |
5 mm x 5 mm |
| Delivery time |
3-4 weeks |
Anti-sticking layer (ASL) and dicing are optional
Examples
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Sub-Micro Standard Stamp
Examples of patterns and features
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Related information
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