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Hot embossing is very similar to thermal nanoimprint lithography. Hot embossing is in contrary to thermal NIL characterized by structuring of polymer films that are much thicker than the height of the patterns being embossed. This makes it easier to achieve complete filling of the polymer into the mold.
Hot embossing is typically used in fabrication of µ-fluidic products, lab-on-a-chip components and in fabrication of µ-lenses.
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