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NILT offers electron beam lithography services based on a Jeol JBX 9500 FSZ system (backup system: Jeol JBX 9300 FS).
The minimum achieved linewidth is 10 nm on this system. The JBX 9500 FSZ is a 100 kV system with a writing field of 1,000 µm x 1,000 µm. The system can expose 50 mm, 100 mm, 150 mm and 200 mm wafers as well as 6025 and 65 mm x 65 mm mask blanks.
NILT also offers a wide variety of pre- and post-processing of wafers if required.
| Jeol JBX 9500 FSZ |
Specifications |
| Acceleration voltage |
100kV |
| Writing field |
1000 µm x 1000 µm |
| Max stiching error between fields |
9 nm |
| Spot size |
4 nm +/-1 nm |
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| Resolution |
10 nm |
| Registration accuracy |
Better than 11 nm across 6 inch x 6 inch area |
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| Substrate sizes |
2 inch wafer |
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4 inch wafer |
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6 inch wafer |
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8 inch wafer |
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65 mm x 65 mm fused silica plates |
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6025 mask blanks |
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| Resist |
ZEP520A |
| Customer specified resists can be used |
HSQ (negative tone) |
| upon request |
SAL (negative tone) |
Examples
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EBL Service
Various patterns and features |
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Design file requirements
In order to allow easy handling of design files in GDSII, DXF, TDB or CIF format, the design file must fulfill the following:
- The design file must contain all objects in the design in the correct dimensions, layout and polarity.
- All objects in the design file must be polygons – no circular objects or line objects are allowed.
All design files handed over to NILT are kept strictly confidential and all design file data is deleted upon customer request. |
