NILT® Silicon
 
NILT Custom Stamps are stamps engineered according to customer specifications and design. These stamps are suitable for application developments and prototyping.
 
The NILT® Silicon stamps are custom engineered stamps in silicon for wafer scale imprinting or step-and-repeat imprinting, typically in a thermal imprint set-up. The NILT Custom Stamps fit into all commercially available NIL tools and they are patterned by state-of-art electron beam lithography with structures down to 20 nm (pattern dependent).
 
NILT® Silicon stamps are engineered for the specific purpose. NILT assists the customer in all necessary aspects related to the design of NILT Custom Stamps.

Specifications:

Stamp material
Silicon
Stamp size
2", 3", 4" and 6" round wafer format and any rectangular shape within these boundaries
Stamp thickness
Typically 500 µm, maximum 2 mm
Pattern size From 20 nm
Aspect ratio From 1:2 - 1:10 (pattern dependent)
Design
Customer specified
Anti-sticking layer (ASL)
Optional




Example: Custom stamp in Silicon
 
Click to enlarge
 
 

 


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